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|a 1-560-32971-8
|b acid-free
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|a US
|b 2002066209
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| 100 |
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|a 20030310d2003 u u fre 0103
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0 |
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|a eng
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| 102 |
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|a US
|b ny
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| 105 |
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|a a a 001|y
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| 200 |
1 |
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|a Thermal stresses
|b Texte imprimé
|f Naotake Noda, Richard B. Hetnarski, Yoshinobu Tanigawa
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| 205 |
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|a 2ème éd.
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| 210 |
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|a New York
|c Taylor & Francis
|d 2003
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| 215 |
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|a xiv, 493 p.
|c ill.
|d 24 cm
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| 320 |
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|a Bibliogr. p. 485-487. Index.
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| 606 |
1 |
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|3 PPN030855829
|a Fatigue thermique
|2 rameau
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| 606 |
1 |
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|3 PPN027363910
|a Contraintes thermiques
|2 rameau
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| 676 |
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|a 620.1/121
|v 21
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| 680 |
|
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|a TA418.58
|b .N63 2003
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| 700 |
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1 |
|a Noda
|b Naotake
|4 070
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| 701 |
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1 |
|a Hetnarski
|b Richard B.
|4 070
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| 702 |
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1 |
|a Tanigawa
|b Yoshinobu
|4 070
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| 801 |
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0 |
|b DLC
|g AACR2
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| 801 |
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3 |
|a FR
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| 930 |
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|5 441092105:171585488
|b 441092105
|a M2320
|j g
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| 993 |
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|a 0210134071
|b TEC
|c M2320
|d EM
|e TECH
|f I
|g 31-10-2002
|h 10-03-2003
|k 181.92
|p 0
|t EM
|u TECH
|v i
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| 998 |
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|a 12408
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