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01156nam a2200313 4500 |
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PPN061750808 |
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20141215093800.0 |
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|a 0-8155-1340-2
|d $125.00
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|a US
|b 9326689
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100 |
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|a 20020717d1993 u y0undy0103 ba
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101 |
0 |
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|a eng
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102 |
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|a US
|b nj
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105 |
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|a a az 001|y
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200 |
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|a Handbook of multilevel metallization for integrated circuits
|b texte imprimé
|e materials, technology, and applications
|f edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr
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210 |
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|a Park Ridge, N.J., U.S.A.
|c Noyes
|d c1993
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215 |
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|a xxiii, 887 p.
|c ill.
|d 25 cm
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225 |
2 |
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|a Materials science and process technology series
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320 |
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|a Includes bibliographical references and index.
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410 |
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|t Materials science and process technology series
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606 |
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|3 PPN027223221
|a Circuits intégrés
|2 rameau
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676 |
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|a 621.3815
|v 20
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680 |
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|a TK7874
|b .H3493 1993
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702 |
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1 |
|a Wilson
|b Syd R.
|4 340
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702 |
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1 |
|a Tracy
|b Clarence J.
|4 340
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702 |
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1 |
|a Freeman
|b John L.
|4 340
|
801 |
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3 |
|a FR
|b Abes
|c 20020717
|g AFNOR
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801 |
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|b DLC
|g AACR2
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930 |
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|5 441092105:155374311
|b 441092105
|a 621.381 5 HAN
|j u
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998 |
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|a 5162
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